Developing advanced process and interface technologies for next-generation semiconductor packaging, including HBM, chiplet integration, and quantum devices. We integrate wafer thinning, planarization, cleaning, bonding, and metrology to enable reliable, high-density integration.
Developing precision material-removal processes, including chemical mechanical polishing (CMP) and wafer back-grinding, for smooth, low-damage, and integration-ready surfaces. We design pads, slurries, and process conditions based on contact mechanics and surface engineering.
Developing post-cleaning technologies to remove particles and residues generated during polishing and grinding. We investigate brush-based cleaning through contact mechanics, friction, and particle-detachment mechanisms.
Developing hybrid bonding technologies for 3D chip stacking and fine-pitch interconnects. Our research focuses on thermocompression bonding and Cu-Cu direct bonding, with emphasis on Cu diffusion, creep deformation, surface activation, and bonding reliability for advanced semiconductor packaging.
Investigating friction and torque-transfer mechanisms in bolted joints for automated fastening. Our research links surface conditions, coatings, and lubrication to torque transfer, preload consistency, and fastening reliability for robust assembly.
Investigating the friction mechanisms of electroactive PVC-gel materials under varying electrical and contact conditions. We leverage electrically tunable friction to develop lightweight haptic interfaces for wearable robots and haptic gloves.
Integrating AI and physics-informed neural networks (PINNs) frameworks for manufacturing process design. We develop predictive and inverse-design frameworks for manufacturing processes, complex structures, and material interfaces.
Evaluating surface quality and process reliability for polishing, cleaning, bonding, and assembly processes. We correlate process conditions with surface quality, interfacial integrity, and device performance to ensure reliable manufacturing.
ManuFuture Laboratory (MFL)가 새롭게 오픈하였습니다.
ManuFuture Lab은 Manufacture + Future, 이름 그대로 미래의 제조기술을 고민하고 만들어가는 연구실입니다.
MFL의 로고에도 이런 의미를 담았습니다. M과 F를 하나로 연결해 열쇠 모양으로 만들어보았는데요,
우리의 연구가 미래 제조의 문을 여는 하나의 열쇠가 되기를 바라는 마음을 담았습니다.
앞으로 연구 성과 등 다양한 소식을 지속적으로 업데이트할 예정입니다. 많은 관심 부탁드립니다.
Welcome to ManuFuture Laboratory. Let’s shape the future of manufacturing!
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