Conference Presentations
  1. S. Kang, C. Jeon, K. M. Kim*, S. Kim*, Advanced Chemical Mechanical Polishing for Cu/Polymer Hybrid Bonding, oral presentation in Material Research Society (MRS) 2026 Spring, Hawaii, USA, May 2026
  2. D. G. Kim, S. Kang, S. Kim*, Mechanically Graded Microstructured Polishing Pads for Defect-Suppressed Planarization Fabricated by Vat Photopolymerization Additive Manufacturing, poster presentation in Material Research Society (MRS) 2026 Spring, Hawaii, USA, May 2026
  3. C. Jeon, S. Kang, S. Kim*, K. M. Kim*, Chemical mechanical polishing of plasma-modified Cu/polymer interfaces for advanced hybrid bonding, poster prestation in Korean Conference on Semiconductors (KCS), Jeongseon, South Korea, January 2026
  4. S. Kang, C. Jeon, G. Park, K. M. Kim*, S. Kim*, Chemical Mechanical Polishing for Polymer-based Hybrid Bonding, oral presentation in Korean Society for Precision Engineering (KSPE), Yeosu, South Korea, November 2025
  5. S. Kang, C. Jeon, J. Park, S. Park, K. M. Kim*, S. Kim*, Plasma-Assisted Chemical-Mechanical Polishing for Cu/Polymer Hybrid Bonding Interfaces, oral presentation in International Symposium on Microelectronics and Packaging (ISMP), Daegu, South Korea, November 2025
  6. S. Kang, C. Jeon, J. Park, S. Park, K. M. Kim*, S. Kim*, Planarization of Cu/Polymer Interfaces via Plasma-Assisted CMP for Hybrid Bonding, oral presentation in International Conference on Planarization Technology (ICPT), Hong kong, China, October 2025
  7. S. Kang, C. Jeon, K. M. Kim*, S. Kim*, Chemical Mechanical Polishing of polymer surface for hybrid bonding in advanced semiconductor packaging, oral presentation in Korean Tribology Society (KTS), Jeju, South Korea, October 2025
  8. S. Kang, S. Yun, H. Hwang, S. Kim*, Analysis of Bearing Friction Deviation in Bolted Joints of Coated Steel Sheets, oral presentation in Korean Tribology Society (KTS), Jeju, South Korea, October 2025
  9. S. Kim*, S. Park, S. Kang, D. G. Kim, Mitigation of Cu dishing in chemical mechanical polishing using micro-structured pads, oral presentation in CIRP General Assembly, Stockholm, Sweden, August 2025
  10. S. Park, S. Kang, D. G. Kim, S. Kim*, Improvement of Structural Uniformity in Pad Surfaces for Control of Dishing Defect in Chemical Mechanical Polishing, oral presentation in Korean Society for Precision Engineering (KSPE), Jeju, South Korea, May 2025
  11. S. Kim*, S. Park, S. Kang, D. G. Kim, Chemical Mechanical Polishing for Enhancement of Hybrid Bonding Strength, oral presentation in Korean Society for Precision Engineering (KSPE), Jeju, South Korea, May 2025
  12. Y.-J. Kim*, G. Kang, J. Kim, J. H. Park, S. Kang, D. G. Kim, S. Kim*, High-precision Terahertz Interferometry for Monitoring Semiconductor Wafer Thinning Process, oral presentation in Korean Society for Precision Engineering (KSPE), Jeju, South Korea, May 2025
  13. S. Kang, S. Yun, H. Hwang, S. Kim*, Effect of Plowing Friction in Bolt Fastening on Coated Steel Plates, oral presentation in International Conference on Manufacturing, oral presentation in International Conference on Manufacturing, Machine Design and Tribology (ICMDT), Himeji, Japan, April 2025
  14. C. Jeon, S. Kang, S. Kim*, K. M. Kim*, Ru Passivation Layer Enables Cu-Cu Direct Bonding at Low Temperatures with Oxidation Inhibition, poster presentation in Material Research Society (MRS), Seattle, WA, USA, April 2025
  15. S. Kang, C. Jeon, J. Park, S. Park, K. M. Kim*, S. Kim*, Cu/Polymer Hybrid Bonding with Plasma-Assisted Chemical Mechanical Polishing, oral presentation in The Korean Microelectronics and Packaging Society (KMEPS), Incheon, South Korea, April 2025
  16. S. Park, S. Kang, D. G. Kim, S. Kim*, Modeling and Reduction of Cu Dishing according to Pad Surface Properties in Chemical Mechanical Polishing, poster presentation in The Korean Microelectronics and Packaging Society (KMEPS), Incheon, South Korea, April 2025
  17. S. Kang, J.-h. Jeong, H. J. Ryu, S. Kim*, Nano Sandpaper using Carbon Nanotubes as Coated Abrasives for Ultraprecision Surface Finishing, oral presentation in Young Korean Academy of Science and Technology (YKAST) International Conference, Busan, South Korea, February 2025
  18. S. Kang, C. Jeon, S. Park, J. Park, K. M. Kim*, S. Kim*, Cu/Polymer CMP Technology for Heterogeneous Semiconductor Integration, oral presentation in 80th Korea Chemical Mechanical Planarization Users Group Meeting (CMPUGM), Suwon, South Korea, November 2024
  19. J.-H. Son, J. Han, H.-D. Lee, S. Kang, S. Kim*, H.-J. Lee*, Optimization of Additives to Fabricate Fine-Grained Cu via Electroplating for Cu-Cu Direct Bonding, poster presentation in International Symposium on Microelectronics and Packaging (ISMP), Busan, South Korea, November 2024
  20. S. Kang, H. J. Ryu, J.-h. Jeong, T. Kim, S. Kim*, Nano Sandpaper for Precise Surface Refinement Using Vertically Aligned Carbon Nanotubes, oral presentation in Korean Society of Mechanical Engineers (KSME) Annual Meeting, Jeju, South Korea, November 2024
  21. D. G. Kim, S. Kang, S. Park, S. Kim*, Soft Microstructured Surfaces with Ultrathin Hard Skin Fabricated by Stereolithography, oral presentation in Korean Society of Mechanical Engineers (KSME) Annual Meeting, Jeju, South Korea, November 2024
  22. S. Park, S. Kang, D. G. Kim, S. Kim*, Precision Dishing Control in Chemical Mechanical Polishing using Surface Structured Pads for Hybrid Bonding, poster presentation in Korean Society of Mechanical Engineers (KSME) Annual Meeting, Jeju, South Korea, November 2024
  23. I. Yang, D. Won, S. Kang, S. Kim*, Ultrathin Nanoporous Cu with Lithiophilicity-Lithiophobicity Gradient by MWCNT for Anode-Free Li-Metal Battery Anode Current Collector, poster presentation in Korean Society of Mechanical Engineers (KSME) Annual Meeting, Jeju, South Korea, November 2024
  24. S. Kang, C. Jeon, S. Park, J. Park, K. M. Kim*, S. Kim*, Chemical Mechanical Polishing of Polymer Surfaces for Cu/Polymer Hybrid Bonding Process, oral presentation in Korean Research Group for Polishing Technology (KRGPT), Daejeon, South Korea, October 2024
  25. H. Hwang, S. Kang, S. Yun, S. Kim*, Development of Methodology for Predicting Friction Coefficient in Bolt and Coated/Uncoated Steel Plate Fastening, oral presentation in Korean Society of Automotive Engineers (KSAE), Geoje, South Korea, June 2024
  26. S. Kang, C. Jeon, K. M. Kim*, S. Kim*, CMP Technology for Cu/Polymer in 3D Stacked Semiconductor Fabrication, oral presentation in Korean Society for Precision Engineering (KSPE), Jeju, South Korea, May 2024
  27. H. Choi, S. Kang, M. Gyeon, Y. Kim, M. Jeong, K. Kang*, S. Kim*, J. Heo*, Low-temperature polycrystalline Ge growth on PtSe2 for BEOL compatible devices, poster presentation in International Conference on Electronics, Information, and Communication (ICEIC), Taipei, Taiwan, January 2024
  28. S. Kang, J. Park, C. Jeon, K. M. Kim*, S. Kim*, CMP Technology for Cu/Polymer Hybrid Bonding, oral prestation in Korean Conference on Semiconductors (KCS), Gyeongju, South Korea, January 2024
  29. S. Kang, J.-h. Jeong, H. J. Ryu, D. Won, S. Kim*, Plasma etched vertically aligned carbon nanotube embedded polyurethane surface for precision semiconductor wafer polishing, poster presentation in Material Research Society (MRS), Boston, MA, USA, November 2023
  30. I. Yang, D. Won, S. Kang, S. Kim*, Ultrathin Nanofibrillar Cu Sheet Covered with Directly Grown Lithiophobic CNT for Anode-free Li-metal Battery Anode Current Collectors, poster presentation in Material Research Society (MRS), Boston, MA, USA, November 2023
  31. M. Kim, S. Kang, S. Kim*, K. M. Kim*, Demonstration of Ruthenium Passivation for Cu-to-Cu Direct Bonding, oral presentation in International Conference on Advanced Electromaterials (ICAE), Jeju, South Korea, November 2023
  32. S. Kang, J. Park, C. Jeon, K. M. Kim*, S. Kim*, Plasma-Assisted CMP for Planarization of Adhesive Polymers in 3D Stacked Semiconductor Devices, poster presentation in International Conference on Planarization Technology (ICPT), Kanazawa, Japan, November 2023
  33. S. Kang, J.-h. Jeong, S. Kim*, Advanced Polishing Technology Using Vertically Aligned Carbon Nanotube Thin Films, poster presentation in Advanced Epitaxy for Freestanding Membranes and 2D Materials (AEFM), Seoul, South Korea, July 2023
  34. S. Kang, S. Yun, H. Hwang, S. Kim*, Effect of coating hardness and thickness on friction in bolt fastening, poster presentation in 3rd Korea-Tribology International Symposium (K-TRIB), Busan, South Korea, April 2023
  35. H. J. Ryu, J.-h. Jeong, S. Kang, Y. S. Eom, S. Kim*, Fracture and Wear Behavior of Hard-on-Soft Bi-layered Polyurethane Surfaces, oral presentation in 3rd Korea-Tribology International Symposium (K-TRIB), Busan, South Korea, April 2023
  36. S. Kang, J. Park, K. M. Kim*, S. Kim*, Self-pressure regulating CMP process for hybrid Cu/polymer bonding, oral presentation in 3rd Korea-Tribology International Symposium (K-TRIB), Busan, South Korea, April 2023
  37. S. Yun, S. Kang, H. Hwang, S. Kim*, Characterization of Friction between Bolts and Coated Steel Plates, oral presentation in 3rd Korea-Tribology International Symposium (K-TRIB), Busan, South Korea, April 2023
  38. J. Park, S. Kang, S. Kim*, K. M. Kim*, Polymer/Cu hybrid CMP process for high-reliability of Cu direct bonding, oral presentation in International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE), Jeju, South Korea, November 2022
  39. S. Kang, S. Shin, H. Hwang, S. Kim*, Friction Variation in Bolt Fastening according to Contact Surface Profiles, oral presentation in Korea-Japan Tribology Symposium (KTS), Goseong, South Korea, October 2022
  40. S. Kang, J.-h. Jeong, S. Kim*, Fabrication and Characterization of Fixed-Nano-Abrasive Polishing Pads using Vertically Aligned Carbon Nanotubes, poster presentation in International Conference on Planarization Technology (ICPT), Portland, Oregon, USA, September 2022
  41. S. Kim*, S. Kang, S. Shin, H. Hwang, Predictive model for bearing torque in bolt fastening, oral presentation in CIRP General Assembly, Bilbao, Spain, August 2022
  42. S. J. Kim, J.-h. Jeong, S. Kang, S. Kim*, Engineered vertically-aligned CNT for plasmon-enhanced optical sensing with programmable molecular delivery, poster presentation in Material Research Society (MRS), Honolulu, Hawaii, USA, May 2022
  43. S. Kang, S. J. Kim, J.-h. Jeong, S. Kim*, Abrasive Wear and Surface Polishing by Vertically Aligned Carbon Nanotubes, oral presentation in Korean Society for Precision Engineering (KSPE), Busan, South Korea, November 2021
  44. S. Kang, S. Shin, H. Hwang, S. Kim*, Effect of bolt surface properties on characteristics of tightening friction, poster presentation in Korean Society for Precision Engineering (KSPE), Busan, South Korea, November 2021
  45. H. J. Ryu, D. G. Kim, S. Kang, J.-h. Jeong, S. Kim*, Manipulating Mechanical Properties of Pad Surface Asperities for Material Removal Rate Enhancement in Chemical Mechanical Polishing, oral presentation in Korean Society for Precision Engineering (KSPE), Busan, South Korea, November 2021
  46. S. Kang, S. Shin, H. Hwang, S. Kim*, Prediction of underhead friction coefficient in bolt tightening, oral presentation in Korean Tribology Society (KTS), Jeju, South Korea, October 2021
  47. S. Kim*, H. J. Ryu, D. G. Kim, S. Kang, J.-h. Jeong, Mechanical abrasion by bi-layered pad micro-asperity in chemical mechanical polishing, oral (online) presentation in CIRP General Assembly, Paris, France, August 2021
  48. S. Kang, S. J. Kim, J.-h. Jeong, S. Kim*, Abrasive polishing using composite pads with fixed vertically aligned carbon nanotubes, oral (online) presentation in PRESM, Jeju, South Korea, July 2021
  49. S. Kang, S. J. Kim, J.-h. Jeong, S. Kim*, Fabrication of fixed-abrasive pads using vertical aligned CNTs and analysis of its mechanical polishing performances, poster (online) presentation in Korean Society for Precision Engineering (KSPE), Jeju, South Korea, May 2021
  50. S. Kang, S. Shin, H. Hwang, S. Kim*, Characteristics of tightening friction by surface topography of bolt underhead, oral (online) presentation in Korean Tribology Society (KTS), South Korea, April 2021
  51. H. J. Ryu, D. G. Kim, S. Kang, J.-h. Jeong, S. Kim*, Chemical-mechanical polishing of soft pad asperity with protective hard thin film, poster (online) presentation in International Conference on Precision Engineering and Sustainable Manufacturing (PRESM), Seoul, South Korea, November 2020
  52. H. J. Ryu, D. G. Kim, S. Kang, J.-h. Jeong, S. Kim*, Characterization of CMP Process at Single Contact Point of Pad Micro-Asperity, poster presentation in Korean Tribology Society (KTS), Daejeon, South Korea, September 2020
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