Submitted/Under review/In revision

• Precision multi-layer Terahertz measurement for semiconductor wafer back-grinding, Guseon Kang, Hyunsu Kim, Sukkyung Kang, Jinwoo Jeon, Jaeyoon Kim, Sanha Kim, Young-Jin Kim, under review.

Accepted/Published

20. Data-free physics-informed inverse programming of bistable kirigami energy landscapes

Sukheon Kang, Sukkyung Kang, Sanha Kim, Seunghwa Ryu

Materials Horizons, accepted

(* selected as front cover)

[doi] [pdf]

19. Asymmetric-beam steady-state thermoreflectance for three dimensional anisotropic thermal conductivity measurements

Juhong Kim, Dong-min Kim, Jeongmin Nam, Dongkyu Kim, Wonjeong Lee, Sukkyung Kang, Sanha Kim, Bong Jae Lee, Joon Sang Kang

Review of Scientific Instruments, 97, 7, 2026

[doi] [pdf]

18. Surface-modified anode current collectors via lithiophilic zinc-based bimetallic co-electrodeposition for lithium-metal batteries

Dong Geun Kim, Dongyeon Won, Inyeong Yang, Sukkyung Kang, Jae Young Seok, Hyunwoong Baek, Sanha Kim

Nanoscale Horizons, 11, 1578-1589, 2026

[doi] [pdf]

17. Challenges and innovations in chemical mechanical polishing in the More-than-Moore era

Hyeongmin Je#, Sukkyung Kang#, Sanha Kim

International Journal of Precision Engineering and Manufacturing - Green Technology, online published, 2026

[doi] [pdf]

16. Carbon nanotube sandpaper for atomic-precision surface finishing

Sukkyung Kang, Ji-hun Jeong, Hyun Jun Ryu, Gunhoo Park, Sanha Kim

Advanced Composites and Hybrid Materials, 9, 44, 2026

(* featured at KAIST News, phys.org, 동아사이언스, 매일경제, 국가나노기술정책센터, 서울경제, Semiconductor Engineering and more…)

[doi] [pdf]

15. Effects of grain size on bonding performance of Cu-to-Cu bonding

Hyun-Dong Lee#, Sukkyung Kang#, Yeo-Jin Kim, Eun-Ho Lee, Sung-Ho Park, Won-Seob Cho, Yong-Jin Park, Alexandra Haag, Soichi Watanabe, Marco Arnold, Sanha Kim, Hoo-Jeong Lee

Journal of Materials Research and Technology, 36, 8965-8974, 2025

[doi] [pdf]

14. Chemical mechanical polishing of plasma-modified Cu/polymer interfaces for advanced hybrid bonding

Sukkyung Kang#, Chansu Jeon#, Juseong Park, Seulah Park, Kyung Min Kim, Sanha Kim

Advanced Science, 13, 3, e12611, 2025

(* featured at Semiconductor Engineering)

[doi] [pdf]

13. An ionic gelation powder for ultrafast hemostasis and accelerated wound healing

Youngju Son, Kyusoon Pak, Taehoon Lee, Monica Celine Prayogo, Jinyoung Choi, Sukkyung Kang, Minjoo Kang, Byungkook Oh, Sang Yu Sun, Sanha Kim, Sung Gap Im, Sangyong Jon, Steve Park

Advanced Functional Materials, 36, 22, e23910, 2025

[doi] [pdf]

12. Modeling framework and discussion of microstructural effects on the formation of Cu–Cu bonding interfaces in semiconductor stacking

Jae-Uk Lee, Hyun-Dong Lee, Sung-Hyun Oh, Young-Dae Shim, Sukkyung Kang, Sanha Kim, Hoo-Jeong Lee, Eun-Ho Lee

International Journal of Plasticity, 195, 104501, 2025

[doi] [pdf]

11. Frequency-comb-referenced Terahertz Fabry-Pérot interferometry for monitoring semiconductor wafer thinning process with a nanometer precision

Guseon Kang, Jaeyoon Kim, Jun Hyung Park, Sukkyung Kang, Dong Geun Kim, Young Jin Kim

CIRP Annals - Manufacturing Technology, 74, 1, 679-683, 2025

[doi] [pdf]

10. Mitigation of Cu Dishing in Chemical Mechanical Polishing using Micro-Structured Pads

Seulah Park#, Sukkyung Kang#, Dong-Geun Kim#, Sanha Kim

CIRP Annals - Manufacturing Technology, 74, 1, 465-469, 2025

[doi] [pdf]

9. Characteristics of PVD SiCN for Application in Hybrid Cu Bonding

Junyoung Choi, Suin Jang, Dongmyeong Lee, Sukkyung Kang, Sanha Kim, Sarah Eunkyung Kim

Journal of Semiconductor Technology and Science, 25, 1, 102, 2025

[doi] [pdf]

8. Nanometer-resolution white-light scanning interferometry for surface-profiling of hybrid bonding samples for advanced semiconductor packaging

Huy Hoang Chu#, Dae Hee Kim#, Jun Hyung Park, Sukkyung Kang, Jaiho Son, Hyunmin Lee, Hongki Yoo, Seung-Woo Kim, Sanha Kim, Young-Jin Kim

Applied Surface Science, 689, 162466, 2025

[doi] [pdf]

7. Analysis of Torque Variation in Bolt Fastening on Coated Steel Surfaces

Sukkyung Kang#, Seounghee Yun#, Hyena Hwang, Sanha Kim

Tribology International, 202, 110395, 2025

[doi] [pdf]

6. Ru Passivation Layer Enables Cu–Cu Direct Bonding at Low Temperatures with Oxidation Inhibition

Chansu Jeon#, Sukkyung Kang#, Myeong Eun Kim#, Juseong Park, Daehee Kim, Sanha Kim, Kyung Min Kim

ACS Applied Materials & Interfaces, 16, 36, 48481-48487, 2024

[doi] [pdf]

5. Nanotransfer Printing for Synthesis of Vertically Aligned Carbon Nanotubes with Enhanced Atomic Penetration

Ji-Hwan Ha#, Inyeong Yang#, Junseong Ahn#, Sukkyung Kang, Zhi-Jun Zhao, Yongrok Jeong, Hyeongmin Je, Joono Cheong, Soon Hyoung Hwang, Sohee Jeon, Jun-Ho Jeong, Sanha Kim, Inkyu Park

Advanced Functional Materials, 34, 42, 2315028, 2024

(* selected as front cover)

[doi] [pdf]

4. Advanced Cu/Polymer hybrid bonding system for fine-pitch 3D stacking devices

Juseong Park#, Sukkyung Kang#, Myeong Eun Kim, Nam Jun Kim, Jungkyun Kim, Sanha Kim, Kyung Min Kim

Advanced Materials Technology, 8, 20, 2202134, 2023

[doi] [pdf]

3. Predictive Model for Bearing Torque in Bolt Fastening

Sukkyung Kang#, Somin Shin#, Hyena Hwang, Sanha Kim

CIRP Annals - Manufacturing Technology, 71, 1, 489-492, 2022

[doi] [pdf]

2. Development of cutoff size adjustable omnidirectional inlet cyclone separator

Jun-Hyung Lim, Sung-Hyeon Oh, Sukkyung Kang, Kyung-Joo Lee, Se-Jin Yook

Separation and Purification Technology, 276, 1, 11937, 2021

[doi] [pdf]

1. Mechanical abrasion by bi-layered pad micro-asperity in chemical mechanical polishing

Hyun Jun Ryu, Dong Geun Kim, Sukkyung Kang, Ji-Hun Jeong, Sanha Kim

CIRP Annals - Manufacturing Technology, 70, 1, 273-276, 2021

[doi] [pdf]